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按工序看机器人化 / Electronics & Semiconductors

SMT Board Assembly to Final Product Line

Printing, placement, and reflow are already automated, but reel setup, odd-form insertion, connector mating, test-fixture loading, and packing still rely on people. Here is what robots can take over at each step, from placement-machine makers and cobot deployments.

全部9道工序中，有8道工序共16项作业可由机器人承担。

Illustration of an SMT-to-assembly electronics line, including FOUP transport, with robots

工序流程

点击工序可跳转到对应作业。

  1. 1Receiving1项
  2. 2Supply3项
  3. 3Placement
  4. 4Board inspection1项
  5. 5Insertion2项
  6. 6Assembly3项
  7. 7FCT1项
  8. 8Packing & shipping2项
  9. 9FOUP3项
可由机器人承担专用设备承担由人承担

工序来源：電波新聞デジタル「実装機動向」(2025-06) / サンテクノロジー SMTライン / マイナビ OKIテクノパワーシステムズ 工場レポート

各工序的替代作业

按工序列出人工作业中已有机器人承担实例的项目，可从右侧链接查看候选机型与导入实绩。

  1. Material receiving & storage

    Inspect and register reels, trays, and board magazines, then move them in and out of racks or automated storage.

    可机器人化

  2. Component supply & feeder setup

    Load reels into feeders and carry cassettes or magazines to the placement machine for changeover.

    可机器人化

  3. Solder printing, placement & reflow

    Printer, placement machine, and reflow oven run automatically; people handle mask changes, stock-outs, and error recovery.

    专用设备

    Already automated by dedicated equipment; the remaining manual work (setup and replenishment) is covered in step 2.

  4. Inspection (SPI / AOI / AXI / ICT)

    SPI, AOI, and X-ray run automatically; for ICT, a person sets each board in a fixture.

    可机器人化

  5. Through-hole insertion & hand soldering

    People insert large or odd-form leaded parts and run the board through wave solder; large parts are hand-soldered.

    可机器人化

  6. Depaneling & enclosure assembly

    Depanel boards, fit them into the enclosure, drive screws, and mate FPC/FFC cables to connectors.

    可机器人化

  7. Functional test (FCT)

    Power up the assembled product and test operation and touch panels; loading fixtures and judging results are manual.

    可机器人化

  8. Packing & shipping

    Pack boards and products into trays and boxes, then move them to the shipping area.

    可机器人化

  9. Semiconductor front-end: FOUP transport

    Carry 25-wafer FOUPs to tool load ports. Overhead transport (OHT) is standard in 300 mm fabs, but carts and people remain in older fabs and back-end plants.

    可机器人化

一览

工序可由机器人承担的作业阶段应用指南
1. Material receiving & storageAutomate feeder and reel storage, issuing what each build needs from the production plan已有产品Transport, Storage & Retrieval
2. Component supply & feeder setupLoading tape reels into feeders: removing empties, reading IDs, preparing tape, and loadingPoC阶段Raw Material Feeding & Supply
2. Component supply & feeder setupDelivering component magazines to the placement machine by AMR and swapping out empties海外有实绩Raw Material Feeding & Supply
2. Component supply & feeder setupUnattended feeder-cassette changeover and AMR delivery of setup items such as metal masksPoC阶段Raw Material Feeding & Supply
4. Inspection (SPI / AOI / AXI / ICT)Loading high-mix boards into existing testers and fixtures, judging pass/fail by image, and sorting日本已导入Inspection & Quality Control
5. Through-hole insertion & hand solderingInserting large and odd-form leaded parts (electrolytic capacitors, coils) and driving screws已有产品Assembly & Processing
5. Through-hole insertion & hand solderingReplacing hand soldering of large parts after reflow with a soldering robot已有产品Assembly & Processing
6. Depaneling & enclosure assemblyInserting thin, flexible FPC/FFC cables into connectors已有产品Assembly & Processing
6. Depaneling & enclosure assemblyPrecision screwdriving and inserting HDDs or memory into server chassis已有产品Assembly & Processing
6. Depaneling & enclosure assemblyHumanoids working on a tablet mass-production linePoC阶段Assembly & Processing
7. Functional test (FCT)Touch-panel testing by pressing with a stylus and checking the response日本已导入Inspection & Quality Control
8. Packing & shippingPlacing small boards into trays and trays into boxes海外有实绩Packing & Palletizing
8. Packing & shippingMoving finished goods to the shipping area by AMR日本已导入Transport, Storage & Retrieval
9. Semiconductor front-end: FOUP transportReplacing cart transport of wafer boxes with AMRs and cobots日本已导入Transport, Storage & Retrieval
9. Semiconductor front-end: FOUP transportMoving material and part containers between cleanroom areas日本已导入Transport, Storage & Retrieval
9. Semiconductor front-end: FOUP transportMobile manipulator moving FOUPs between load portsPoC阶段Transport, Storage & Retrieval

导入前的确认点

  • ESD: match potentials across the robot body, end-effector materials, and grounding; pick models with ESD variants.
  • Cleanliness: front-end fabs are ISO class 3; check cleanroom certification and particle generation from belts and plastics.
  • Placement-machine ecosystems: automatic feeder changeover and magazine delivery are tied to each maker; confirm compatibility with existing machines from other vendors.
  • Packaging and size limits: reel loading automation covers a limited range (e.g., 8 mm tape); check height and weight limits for odd-form parts.
  • Force sensing: FPC insertion, screwdriving, and HDD insertion usually need force control.

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