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Robots in the process flow / Electronics & Semiconductors

SMT Board Assembly to Final Product Line

Printing, placement, and reflow are already automated, but reel setup, odd-form insertion, connector mating, test-fixture loading, and packing still rely on people. Here is what robots can take over at each step, from placement-machine makers and cobot deployments.

8 of 9 steps have robot-ready tasks (16 in total).

Illustration of an SMT-to-assembly electronics line, including FOUP transport, with robots

Process flow

Select a step to jump to its tasks.

  1. 1Receiving1 task
  2. 2Supply3 tasks
  3. 3Placement
  4. 4Board inspection1 task
  5. 5Insertion2 tasks
  6. 6Assembly3 tasks
  7. 7FCT1 task
  8. 8Packing & shipping2 tasks
  9. 9FOUP3 tasks
Robot-ready tasksDedicated equipmentStays with people

Process sources: 電波新聞デジタル「実装機動向」(2025-06) / サンテクノロジー SMTライン / マイナビ OKIテクノパワーシステムズ 工場レポート

Tasks by step

For each step, the tasks people do today that robots already handle somewhere. Follow the link to candidate robots and proven deployments.

  1. Material receiving & storage

    Inspect and register reels, trays, and board magazines, then move them in and out of racks or automated storage.

    Robot-ready
  2. Component supply & feeder setup

    Load reels into feeders and carry cassettes or magazines to the placement machine for changeover.

    Robot-ready
  3. Solder printing, placement & reflow

    Printer, placement machine, and reflow oven run automatically; people handle mask changes, stock-outs, and error recovery.

    Equipment

    Already automated by dedicated equipment; the remaining manual work (setup and replenishment) is covered in step 2.

  4. Inspection (SPI / AOI / AXI / ICT)

    SPI, AOI, and X-ray run automatically; for ICT, a person sets each board in a fixture.

    Robot-ready
  5. Through-hole insertion & hand soldering

    People insert large or odd-form leaded parts and run the board through wave solder; large parts are hand-soldered.

    Robot-ready
  6. Depaneling & enclosure assembly

    Depanel boards, fit them into the enclosure, drive screws, and mate FPC/FFC cables to connectors.

    Robot-ready
  7. Functional test (FCT)

    Power up the assembled product and test operation and touch panels; loading fixtures and judging results are manual.

    Robot-ready
  8. Packing & shipping

    Pack boards and products into trays and boxes, then move them to the shipping area.

    Robot-ready
  9. Semiconductor front-end: FOUP transport

    Carry 25-wafer FOUPs to tool load ports. Overhead transport (OHT) is standard in 300 mm fabs, but carts and people remain in older fabs and back-end plants.

    Robot-ready

Summary

StepRobot-ready taskStageUse-case guide
1. Material receiving & storageAutomate feeder and reel storage, issuing what each build needs from the production planProduct availableTransport, Storage & Retrieval
2. Component supply & feeder setupLoading tape reels into feeders: removing empties, reading IDs, preparing tape, and loadingPoC stageRaw Material Feeding & Supply
2. Component supply & feeder setupDelivering component magazines to the placement machine by AMR and swapping out emptiesProven overseasRaw Material Feeding & Supply
2. Component supply & feeder setupUnattended feeder-cassette changeover and AMR delivery of setup items such as metal masksPoC stageRaw Material Feeding & Supply
4. Inspection (SPI / AOI / AXI / ICT)Loading high-mix boards into existing testers and fixtures, judging pass/fail by image, and sortingIn use in JapanInspection & Quality Control
5. Through-hole insertion & hand solderingInserting large and odd-form leaded parts (electrolytic capacitors, coils) and driving screwsProduct availableAssembly & Processing
5. Through-hole insertion & hand solderingReplacing hand soldering of large parts after reflow with a soldering robotProduct availableAssembly & Processing
6. Depaneling & enclosure assemblyInserting thin, flexible FPC/FFC cables into connectorsProduct availableAssembly & Processing
6. Depaneling & enclosure assemblyPrecision screwdriving and inserting HDDs or memory into server chassisProduct availableAssembly & Processing
6. Depaneling & enclosure assemblyHumanoids working on a tablet mass-production linePoC stageAssembly & Processing
7. Functional test (FCT)Touch-panel testing by pressing with a stylus and checking the responseIn use in JapanInspection & Quality Control
8. Packing & shippingPlacing small boards into trays and trays into boxesProven overseasPacking & Palletizing
8. Packing & shippingMoving finished goods to the shipping area by AMRIn use in JapanTransport, Storage & Retrieval
9. Semiconductor front-end: FOUP transportReplacing cart transport of wafer boxes with AMRs and cobotsIn use in JapanTransport, Storage & Retrieval
9. Semiconductor front-end: FOUP transportMoving material and part containers between cleanroom areasIn use in JapanTransport, Storage & Retrieval
9. Semiconductor front-end: FOUP transportMobile manipulator moving FOUPs between load portsPoC stageTransport, Storage & Retrieval

Before you deploy

  • ESD: match potentials across the robot body, end-effector materials, and grounding; pick models with ESD variants.
  • Cleanliness: front-end fabs are ISO class 3; check cleanroom certification and particle generation from belts and plastics.
  • Placement-machine ecosystems: automatic feeder changeover and magazine delivery are tied to each maker; confirm compatibility with existing machines from other vendors.
  • Packaging and size limits: reel loading automation covers a limited range (e.g., 8 mm tape); check height and weight limits for odd-form parts.
  • Force sensing: FPC insertion, screwdriving, and HDD insertion usually need force control.

Discuss where to start in your own process

Bring your process chart and we will map the easiest tasks to replace, candidate robots, and a PoC plan with you.

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